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Organiser : Business Media China AG Shanghai Science and Technology Development and Exchange Center (SSTDEC)
Supported By: Fraunhofer Institute for Reliability and Microintegration(IZM) University of Rostock
Supporting Association: China Semiconduct Industry Association (CSIA) China Electronic Production Equipment Industry Association (CEPEA) China Electronics Materials Industry Association (CEMIA)
Business Media China AG Business Media China AG was originally created and developed by MESAGO HOLDING. MESAGO - Messe & Kongress GmbH is one of the largest names in the international exhibition and conference industry with world leading events such as SMT / HYBRID / PACKAGING in Nuremberg and many more. This company was founded in 1982 by Klaus M. Hilligardt, Chairman of Business Media China AG, and later integrated into MESAGO HOLDING. Business Media China AG is the guarantor for highest standards and successful international participation in technology events. In Shanghai and throughout China, Business Media China has a team of highly qualified exhibition and conference professionals to develop the group's technology exhibition and conference program. China SMT Forum is the first event of a series of technology forums.
Industrial Backgroud and Development Rapid developments in the industry and consumer demands generate electronic products that are characterized by smaller-size, high functionality and increased reliability. These trends require constantly new components which are produced by new packaging technologies. With the packaging size getting increasingly smaller, there will be a need for the assembling equipment to catch up with more precise and advanced technology in order to meet the new manufacturing standards. The gap between the suppliers of electronic assembly equipment and the semiconductor industry is going to become more and more smaller, forced by the increasing exchange of technology developments in both sectors.. For example, new packaging technologies like BGA, CSP, etc., are effecting the development of Surface Mount Devices which are one of most important driving forces for innovations in the SMT field. Environmental protection will also set new trends for the industries development. Especially Photovoltaic and LED products will raise the demand for electronic devices and new packaging technologies in China. And all these new products will need OEM and ODM to improve their capabilities on a higher manufacturing level. In order to meet these industrial trends, BMC will present the China SMT Forum 2008 at the INTEX Shanghai from November 4-6, 2008. At the conference and the co-located exhibition for electronic packaging and assembly technology, you will meet your suppliers and clients, specialists and key people from science and industry in packaging and assembling fields.
You will meet the delegate from Electronic Manufacturer (OEM/ODM/EMS) Communication Systems or Services Automotive Electronics or Transportation Computer, Systems and Peripheral Equipment Electronics, Semiconductors and ICs Photonics (lasers, laser systems, photovoltaics) Medical / Hospital and Biotechnology Equipment Industrial Electronics Micro systems / Mechatronics / Nanotechnology Aerospace / Aviation Systems Electro-Optical Components, Detectors, Sensors and Cameras Analytical, Test & Measurement Equipment, Quality Assurance Automation & robotics, Industrial Control Systems EHS - Environment, Health, Safety Monitoring Electronics: PCBs, Assemblies, Components Publications, Printing, Graphic Arts R&D Software (control, etc.) Manufacturing Equipment, Machinery, Metal Poducts Others
Exhibits Packaging & Testing Equipment Assembly Equipment Electronic Modules, Assemblies, Components and devices Materials and Tools IC Design EMS/OEM Software Consulting & Services Publications Others
A conference focus on Packaging/Assembly/SMT The conference will welcome speakers and delegates from electronic packaging, assembly and system intergration related industry to the most progressive trading platform in China Quality, competence, and an intimate atmosphere for intensive networking are the conceptual ingredients of the China SMT Forum 2008. The competence of internationally renowned speakers guarantees the high level of the China SMT Forum 2008. The continuing fertile relationship with the Fraunhofer IZM, Berlin and further international institutions guarantees the presence of the most up-to-date technology at the China SMT Forum 2008. Additionally an exclusive exhibition offers selected companies the opportunity to present their products to a highly qualified expert audience.
Conference Topic: Lead-free implementation PCB and Semiconductor Packaging Assembly and Soldering Reliability Markets and Trends (For more information, please contact organizer)
Committee Members
Chairman Professor Mathias Nowottnick (University Rostock)
Vice Chairman Professor Thomas Gessner (Chemnitz University) Professor Bernd Michel (University of Berlin) Rolf Aschenbrenner(Fraunhofer Institute for Reliability and Microintegration)
China Committee Members Mr. Bi Keyun, Vice Chairman of China Semiconductor Industry Association(CSIA), Director of Packaging Branch of CSIA Mr. Jin Cunzhong, China Electronic Equipment Industry Association Mr. Jerry Liang, CTO of Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) Mr. Jack Ding, SMT Materials and Semiconductor & Packaging Materials BU, Manager of Heraeus Materials Technology Shanghai Ltd. Mr. Wang Xingqian, Shanghai Electronic Components Trade Association Prof. Li Ming, Shanghai Jiaotong University
Contact: Business Media China Co., Ltd. Shanghai Branch Address: 17H, No.18, North Caoxi Road, Shanghai, 200030, China Contact: Steven Wu, Kelly Zhu, Barry Bai |